Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level


The MICROPRINCE project is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (μTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transferred to target wafer to demonstrate the capabilities of the technology.



Background Image

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.