2020

231th Institutskolloquium @ TUD
18^th of September, virtual conference
TUD held a presentation on "Fertigung mikroelektronischer Systeme mittels Mikrotransferdruck" at the public 231th Institutskolloquium of the Institute of Precision Engineering and Electronics Design.

IEEE Photonics Conference
29^thSep to 1^st of October, virtual conference
Partner IMEC attended

ECTC - 2020 IEEE 70th Electronic Components and Technology Conference
3^rd to 30^th of June, Online conferenz
Partner TYN presented a paper

SPIE Photonics West
1^st to 6^th of February, San Francisco, USA
Partner TYN represented MICROPRINCE

2019

The International Conference on Wafer Bonding
2^nd to 4^th of December, Halle, Germany
Partners XMF and IMEC represented MICROPRINCE

      EFECS
      19^th to 21^st of November, Helsinki, Finland
      Partner XMF represented MICROPRINCE at a poster presentation

     ESSDERC/ESSCIRC Conference
      23^rd to 26^th of September, Krakow, Poland
      Partner X-FAB gave a presentation

      13th International Conference on Nitride Semiconductors 2019
      7^th to 12^th of July, Seattle, USA
      Partner TYN presented a poster

      OUTPUT.DD 2019
      20^th of June, Dresden, Germany
      Partner TUD represented MICROPRINCE at a poster presentation

      ITG-Tagung Fachbereich Mikro- und Nanoelektronik
      26^th to 29^th of May, Grainau, Germany
      Partner XMF gave a presentation

      ADTC
      14^th to 16^th of May, Dresden, Germany
      Partner XMF & TUD represented MICROPRINCE

      SSI Barcelona 2019
      10^th-11th of April, Barcelona, Spain
      Partners XMF, IMEC, TYN & FhG attended

      CAM Workshop 2019
      10^th of April, Halle, Germany
      Partners XMF & FhG attended

      DATE 2019
      25^th to 29^th of March, Florence, Italy
      TUD attended

      EuroSIME 2019
      24^th to 27^th of March, Hannover, Germany
      FhG attended

Smart Systems Integration trade fair
10^th to 21^th of April 2019, Barcelona Spain
Partners XMF, XCEL, IMEC and TYN presented MICROPRINCE results in a special session.

2018

EFECS
20^th to 22^nd of November 2018, Lisbon, Portugal
XMF attended the conference and to present a poster

International semiconductor laser conference
16^th to 19^th of September 2018, Sante FE, USA
IMEC gave a presentation on Frontiers in III-V laser integration on silicon photonic integrated circuits.

       ANALOG 2018
       13^th to 14^th of September 2018, Munich, Germany
       TUD gave a presentation

ECSEL in Germany
6^th of September 2018, Dresden, Germany
XMF participated in the Congress of the German funding authority, where the focus was on presenting ECSEL program with german contributions and sharing experiences on these kind of projects

2nd ECSEL JU Symposium
19^th to 20^th of June 2018, Brussels, Belgium
XMF represented MICROPRINCE at the 2nd ECSEL JU Symposium in Brussels. The symposium aims to provide a unique opportunity and space for the ECSEL funded projects to present their progress and results to date, to disseminate the scientific and technological achievements, and to show their contributions to the programme.

209th Institutskolloquium @ TUD
6^th of April 2018, Dresden, Germany
TUD (Robert Fischbach, Tilman Horst) held a presentation on "Mikrotransferdruck als Herstellungsverfahren mikroelektronischer Systeme" at the public 209th Institutskolloquium of the Institute of Precision Engineering and Electronics Design.

GI/VDE Fachgruppentreffen
19^th of March 2018, Dresden, Germany
TUD (Tilman Horst) held a presentation on "Technologien und Werkzeuge für die heterogene 3D-Integration"at the GI/VDE Fachgruppentreffen Layoutentwurf. Focus of this workshop lay on Heterogeneous 3D integration.

ISS-Europe
6^th of March 2018, Dublin, Ireland
Tyndall gave a talk about transfer printing in general and then show the route to exploitation through MICROPRINCE.

2017

2017 MRS Fall Meeting & Exhibit
26^th November – 1^st December 2017, Boston / United States
The increasingly cross-disciplinary worldwide activity in materials research manifests itself every year in the MRS Fall Meetings. Featuring over 50 symposia and attended by as many as 6,000 researchers from every corner of the globe, the annual Fall Meeting in Boston is the preeminent annual event for those in the field of materials research. XMF took part and presented the MICROPRINCE project to the audience.

SEMICON Europa
13^th to 17^th of November Munich, Germany
TYN participated at this major exhibit of the semiconductor industry, where Transfer printing is showcased as an emerging technology.

Reliability by Design; 9. ITG/GMM/GI-Symposium
18^th-20^th September 2017, Cottbus, Germany
TUD took part at the 9. ITG/GMM/GI-Symposium and presented their scientific publication on “Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT”

ECSEL JU Symposium
13^th - 14^th of June 2017, Portomaso, St. Julian‘s / Malta
The first Symposium of the ECSEL Joint Undertaking gathers a broad range of participants, discussing the progress of the of the projects funded by the ECSEL JU programme in relation to latest developments in the Electronics Components and Systems field.

5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
16^th - 18^th of May 2017, Tokyo, Japan
XMF participated at the 5th International Workshop on Low Temperature Bonding for 3D Integration. It focused on low-temperature bonding technologies which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D integration of semiconductor devices, photonic systems, and sensing systems.