A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems
Fischbach, Robert; Horst, Tilman; Lienig, Jens

Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications
Goyvaerts Jeroen, Kumari Sulakshna, Uvin Sarah, Zhang Jing, Baets Roel, Gocalinska Agnieszka, Roelkens Günther

Light Extraction Improvement of Transfer Printable GaN LEDs on Si with Backside Roughening
Poster by Zhi Li, Zeinab Shaban, Yan Lei, Mahbub Akhter, James O'Callaghan, Brian Corbett

Micro-transfer-printing for heterogeneous integration 
Brian Corbett, Z. Li, K. Buehler, Falk Naumann, Uwe Krieger, Sebastian Wicht, C.A. Bower

Transfer-printing for heterogeneous integration
Presentation by Tyndall

Design Methodologies and Co-Design Options for Novel 3D Technologies
Tilman Horst, Robert Fischbach, Jens Lienig

Micro-Transfer-Printing and Potential Process Optimizations by FEA
Kjell Buehler, Georg Lorenz, Marcel Mittag, Uwe Krieger, Niclas Heise, Sebastian Wicht, Ronny Gerbach, Falk Naumann
Related presentation also available: https://zenodo.org/record/2677551

MICROPRINCE- Open access pilot line for Micro-Transfer-Printing of functional components on wafer level
Sebastian Wicht, Uwe Krieger, Daniela Guenther, Niclas Heise, Matthias Krojer, Gabriel Kittler, Falk Naumann, Frank Altmann, David Gomez, Alin Fecioru

Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing
Falk Naumann, Kjell Buehler, Marcel Mittag, Georg Lorenz, Uwe Krieger, Sebastian Wicht

Manufacturing Capability of Micro-Transfer Printing
David Gomez, Tanya Moore, Matthew A. Meitl, Salvatore Bonafede, Andrew Pearson, Kanchan Ghosal, Brook Raymond, Erich Radauscher, David Kneeburg, Julia Roe, Alin Fecioru, Steven Kelleher, Antonio Jose Trindade, Christopher A. Bower

Transfer printing for heterogeneous silicon PICs
Gunther Roelkens, Jing Zhang, Sulakshna Kumari, Joan Juvert, Alexandros Liles, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Nayyera Mahmoud, Dries Van Thourhout

MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly
Uwe Krieger, Kanchan Ghosal, Gabriel Kittler, Roy Knechtel, Christopher Bower, Ronny Gerbach
Presentation at 2017 MRS Fall Meeting and Exhibit

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
S. Dempwolf, L. Hofmann, C. Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach

Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT
Robert Fischbach, Andy Heinig, and Jens Lienig, ITG-Fachbericht 274: Zuverlässigkeit und Entwurf (ZuE 2017), VDE Verlag, ISBN: 978-3-8007-4444-2