Micro-transfer-printing of functional components at wafer scale
A short overview of how MicroField brings heterogeneous integration to silicon manufacturing.

MicroField builds a production-grade capability for the heterogeneous integration of smart systems using micro-transfer-printing (μTP) inside a working semiconductor foundry. Functional building blocks such as compound-semiconductor III/V devices, thin-film optical filters and specialised sensors are placed directly onto target wafers, so that complete micro-systems can be assembled at the point where they are used.