MICROPRINCE

Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level

 

The MICROPRINCE project is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (μTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transferred to target wafer to demonstrate the capabilities of the technology.

 

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