2019

An international conference on wafer-bonding technology held in late 2019 A representative from MicroField attended this key event, contributing to discussions on the latest advancements in wafer bonding techniques. The conference provided a valuable platform for sharing insights into cutting-edge semiconductor manufacturing processes and exploring future trends in device fabrication. Discussions covered a range of topics crucial for the integration of complex microelectronic systems.

A European forum on electronic components and systems
      held in late 2019
      One of our technology partners showcased MicroField's contributions at a poster presentation during this significant event focused on electronic components and systems. The display highlighted advancements in semiconductor manufacturing processes and integrated smart systems. Discussions during the event centred on the latest innovations in microelectronics and their application in next-generation technologies.

A European solid-state device and circuits conference
      held in autumn 2019
      The conference will feature a range of presentations from leading experts in the field of microelectronics and semiconductor technology, providing attendees with valuable insights into the latest advancements and innovations. One highlight will be an engaging talk from a prominent foundry, sharing their expertise and developments within the industry. This event serves as an excellent opportunity for networking and collaboration among professionals in the semiconductor sector.

An international conference on nitride semiconductors
held in mid-2019
A key partner presented a poster detailing their latest advancements in the field of nitride semiconductor research. This presentation highlighted recent progress in material growth and device fabrication, offering valuable insights into emerging applications and future development trajectories within this critical area of microelectronics. The findings shared contribute significantly to the ongoing understanding and innovation in semiconductor technology.

A regional microelectronics showcase
      held in mid-2019
      At this significant event, representatives from independent organisations showcased their latest advancements in the field of microelectronics and semiconductor technology. MicroField was presented at a poster session, highlighting innovative research and developments, as well as fostering collaborative discussions among industry professionals and academic researchers.

A technical conference on micro- and nanoelectronics
      held in spring 2019
      A contributing partner delivered a presentation detailing recent advancements in semiconductor manufacturing techniques. The discussion focused on innovative approaches to micro-transfer-printing and its implications for scalable chip production. Furthermore, insights were shared into the challenges and opportunities associated with integrating these novel processes into existing fabrication lines.

During spring 2019
      A specialist technology-development centre showcased MicroField's involvement, highlighting advancements in semiconductor manufacturing and smart-system integration. Discussions centred on novel micro-transfer-printing techniques and cutting-edge chip design and testing methodologies. The event provided a valuable platform for demonstrating progress in these critical areas of microelectronics.

A smart-systems integration event held in 2019 provided a valuable forum for exploring advancements in smart system integration. This gathering brought together leading researchers and industry professionals to discuss the latest innovations and challenges within the semiconductor and microelectronics landscape. Key discussions likely centred on novel manufacturing techniques, intricate chip design methodologies, and the seamless integration of these components into sophisticated smart systems.

A computer-aided manufacturing workshop
held in spring 2019
This event provided a valuable forum for discussing the latest advancements in microelectronics and semiconductor manufacturing. Experts from various fields gathered to share insights on emerging technologies and their practical applications. The workshop also served as an excellent opportunity for networking and fostering collaborations within the research community.

During spring 2019 This event brought together leading minds in microelectronics and semiconductor technology. Discussions focused on advancements in micro-transfer-printing techniques and their application in novel device fabrication. The integration of smart systems and the challenges in chip design and testing were also key topics.

A conference on simulation and reliability in microsystems, held in 2019, provided a valuable platform for discussing advancements in semiconductor manufacturing and micro-system integration. Representatives from independent research institutes were present, contributing to the dialogue on cutting-edge research and development within the field. The event offered a comprehensive overview of the latest trends and challenges shaping the future of microelectronics. Discussions likely covered areas such as advanced packaging, novel materials, and innovative manufacturing processes.

A smart-systems integration trade fair held in spring 2019 At this leading industry event, MicroField's latest advancements in microelectronics and semiconductor technology were showcased. A dedicated session highlighted significant progress in areas such as micro-transfer-printing and the seamless integration of smart systems. These developments hold considerable promise for the future of chip design and testing.

2018

A European electronic-components forum
held in late 2018
A representative from our organisation was present at this significant industry event. They took the opportunity to engage with fellow experts and showcase our latest advancements through a dedicated poster presentation. This provided valuable insights into current trends and fostered important connections within the microelectronics sector.

An international semiconductor-laser conference
held in autumn 2018
A significant presentation at this event explored the cutting edge of III-V laser integration techniques. The focus was on advancing their seamless incorporation into silicon photonic integrated circuits, a crucial step for next-generation optical systems. This research highlights progress in overcoming integration challenges for enhanced performance and functionality.

An analogue-electronics conference
       Taking place in 2018, this event served as a key forum for discussion within the analogue electronics sector. The agenda focused on the latest advancements and future trends shaping this critical area of microelectronics. Experts shared insights on innovative design methodologies and manufacturing techniques relevant to analogue systems.

a national industrial programme
held in 2018
our representative attended a key congress organised by a prominent national funding body. The event highlighted a significant industrial programme with contributions from across the sector, providing a valuable platform for sharing insights and experiences gained from collaborative technology development initiatives.

2nd industry symposium
held in 2018
MicroField attended the 2nd industry symposium that year. This event offered a valuable platform for industry-focused initiatives to showcase their advancements and findings. It provided an excellent venue for disseminating scientific and technological breakthroughs, highlighting their impact and contributions to the wider field.

An institute colloquium, held in 2018, featured a presentation exploring the application of micro-transfer printing as a manufacturing process for microelectronic systems. This innovative technique holds significant promise for the fabrication of intricate microelectronic devices. The session provided valuable insights into the potential of micro-transfer printing for advancing the field of microelectronics.

A technical working-group meeting
held in 2018
A presentation was delivered on "Technologies and Tools for Heterogeneous 3D Integration" at a technical working-group meeting on layout design. The workshop's central theme was the advancement of heterogeneous 3D integration techniques. This approach is crucial for combining diverse semiconductor technologies and functionalities within a single, compact package.

A European smart-systems conference, held in 2018. A presentation at this European conference covered the fundamental principles of transfer printing. The session also explored the pathway towards commercial application of this advanced technology, highlighting its potential for future smart system integration and semiconductor manufacturing.

2017

A major annual materials-research meeting and exhibition, held in 2017, served as a significant convergence point for global materials science. This highly interdisciplinary event typically draws up to 6,000 researchers, showcasing cutting-edge developments across more than 50 symposia. It represents a premier annual gathering for professionals immersed in the diverse landscape of materials research. A representative attended this key event to discuss the MicroField project and its advancements with attendees.

A major European semiconductor exhibition
held in late 2017
A project partner showcased its contributions at this significant exhibition for the semiconductor sector. The event provided a platform to highlight the innovative potential of transfer printing as a disruptive manufacturing technique for advanced electronic systems. Discussions focused on how this technology can enable novel device architectures and streamline the integration of diverse materials.

A symposium on reliability by design
held in 2017
The symposium brought together experts to discuss critical aspects of electronic system design. Our participation highlighted a significant development in the field of heterogeneous systems integration. We presented research focused on a novel simulation-based design methodology, leveraging XML and XSLT for package-level analysis. This work contributes to enhancing the reliability of complex, multi-component electronic systems.

Industry Symposium held in mid-2017 This inaugural symposium brings together a diverse array of experts and stakeholders. Attendees will engage in in-depth discussions regarding the advancements within projects supported by the industry programme. The event will also explore the symbiotic relationship between these project outcomes and the cutting edge of developments in the broader electronic components and systems sector.

An international workshop on low-temperature bonding for 3D integration took place in 2017. This significant event centred on cutting-edge low-temperature bonding techniques, essential for the creation of novel device architectures. Such advancements enable the integration of diverse materials and components, paving the way for innovative manufacturing processes in 3D integration. The workshop explored new possibilities for semiconductor devices, photonic systems, and sensing systems through these sophisticated integration methods.