MicroField brings together expertise from across the microelectronics world — materials specialists, foundry process engineers, sensor and photonics designers, and test and packaging teams. It takes all of these skills working in step to turn micro-transfer-printing from a laboratory result into a manufacturable technology, and it is that breadth of complementary experience, rather than any single discipline, that makes the work possible.

The capabilities we combine

Materials supply   Materials and source-wafer supply, providing the pre-processed substrates and devices that feed the printing line.
Foundry processing   Foundry processing, running micro-transfer-printing within a production semiconductor fabrication environment.
Magnetic sensing   Magnetic sensor design and integration for automotive-grade CMOS.
Read-out electronics   Sensor read-out and mixed-signal integrated-circuit design.
IC design   Integrated-circuit design for sensing systems, focused on performance and reliability in demanding electronic environments such as automotive and industrial control.
Test and qualification   Device test and qualification engineering.
Transfer-printing tooling   Transfer-printing tooling and process know-how, including the elastomer stamps and equipment at the heart of micro-transfer-printing.
Optical communications   Optical communications research, defining the performance targets that integrated photonic links must meet.
Optical coatings   Optical coatings and thin-film filters, supplying the precision optical layers that printed sensors and photonic devices depend on.
Applied research   Applied research into fabrication processes and novel device architectures.
Microelectronics research   Advanced microelectronics research and silicon-photonics process development.
Photonics integration   Photonics integration research, developing transfer-printed III-V devices on silicon.
Design and EDA   Design methodology and electronic design automation for heterogeneous systems.