• This programme centres on the research and development of advanced heterogeneous integration techniques, specifically combining photonic and integrated-circuit (IC) technologies. A key area of focus is the advancement of micro-transfer-printing (µTP) methodologies, tailored for the precise assembly of photonic integrated circuits. This enables the seamless integration of critical III-V semiconductor components, such as lasers, modulators, and photodetectors, paving the way for the creation of high-performance transceivers designed for demanding data and telecommunications applications.

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• This photonics integration research centre stands as a premier global research facility, dedicated to generating substantial economic benefit. Its core objective is to achieve excellence in photonics research and to advance the science of photonic integration, driving the miniaturisation of components. This focus enables the development of pioneering technologies and cutting-edge products.

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• This initiative is exploring advanced micro-transfer-printing (µTP) techniques for integrating edge-emitting lasers directly onto silicon photonic integrated circuits (ICs). This cutting-edge work aims to overcome key challenges in heterogeneous integration, paving the way for more compact and powerful optical systems. By enabling precise placement of laser components onto complex silicon photonics platforms, this technology holds significant promise for next-generation communication and sensing devices. The successful development of these µTP processes is crucial for unlocking the full potential of silicon photonics for high-density chip integration.

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• This effort is pioneering the creation of pilot manufacturing facilities for silicon-nitride photonic integrated circuits, specifically engineered for optimal performance at shorter wavelengths, below one micrometre. To facilitate broader adoption and innovation, open access frameworks are being established, which will include Multi-Project Wafer (MPW) services, enabling designers and researchers to prototype their photonic chip designs efficiently. This initiative aims to accelerate the development and accessibility of advanced photonic technologies for a range of applications.

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• The foundry and our collaborators have successfully demonstrated a printed optical filter integrated onto a CMOS wafer. This achievement, following comprehensive feasibility studies, lays the groundwork for future industrial-scale implementation. The project is now progressing towards the next phase, focusing on bringing this advanced technology to market.