| About MicroField
A pivotal meeting is scheduled to delve into a groundbreaking design tool that has emerged as a significant deliverable from our ongoing microelectronics development efforts. This innovative software solution is engineered to revolutionise the methodologies employed in chip design and testing, aiming to significantly accelerate the pace of innovation and improve the efficiency of semiconductor manufacturing processes. The discussion will highlight the tool's unique features, which are expected to provide substantial benefits across various stages of the electronic system lifecycle, from initial concept through to final validation and integration. Attendees will have the opportunity to engage with the practical implications and future trajectory of this advanced design aid. Specific areas of focus will include its potential to facilitate novel manufacturing techniques such as micro-transfer-printing, and its crucial role in enabling the seamless integration of complex smart-system architectures. The session is designed to foster a collaborative environment, encouraging participants to identify and articulate new avenues for its application, thereby maximising its impact on the broader semiconductor technology landscape and reinforcing its value as a key enabler for future electronic innovations. |
Meeting to discuss a Design tool developed within the MicroField project. This discussion will focus on a novel design tool, a key outcome of the MicroField initiative. The tool aims to streamline and enhance the microelectronics design process, addressing current industry challenges. Attendees will explore its capabilities and potential applications in semiconductor manufacturing and smart-system integration.
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26 March 2019
by MicroField Team
In a recent working session, members of the MicroField team met at a partner foundry to review a new design tool developed within the initiative. The discussion centred on how the tool performs in a real fabrication setting rather than in isolation, and on the practical adjustments needed before it can be relied upon from day to day.
Colleagues from a collaborating research institute presented calculation results for the transfer-printing of optical filters, which prompted a detailed exchange about accuracy, alignment tolerances and the assumptions built into the model. On the strength of that feedback, the user interface of the design tool will be reworked over the coming weeks so that it maps more closely onto the requirements the engineering team actually works to.
A follow-up technical meeting is planned to take the discussion further. Future development will concentrate on selective pick-and-print operations across a range of wafer sizes, comparing source and target substrates, with the transfer-printing of Hall plates serving as a representative test case for the method.
