| About MicroField
MicroField is pleased to announce a technical meeting scheduled for April 23rd, dedicated to advancing discussions within the microelectronics and semiconductor technology landscape. This session will convene leading minds to explore critical developments across several key areas. Particular focus will be placed on the evolving methodologies in semiconductor manufacturing, including innovations in advanced lithography and novel materials. Furthermore, the meeting will delve into cutting-edge techniques in micro-transfer-printing, examining its potential to revolutionise device assembly and integration. Discussions will also address the increasing complexity and demands of smart-system integration, encompassing challenges in heterogeneous integration and power management for next-generation devices. Finally, participants will engage in a review of contemporary approaches to chip design and testing, with an emphasis on strategies for ensuring reliability, performance, and security in increasingly sophisticated silicon architectures. The April 23rd technical meeting offers a valuable platform for professionals and researchers to foster collaboration and knowledge exchange. By bringing together experts from diverse segments of the semiconductor value chain, we aim to identify synergistic opportunities and address the prevalent technical hurdles faced by the industry. The agenda is structured to encourage in-depth dialogue on topics ranging from high-volume semiconductor manufacturing optimisation to the intricate processes involved in micro-transfer-printing for novel device architectures. The challenges and solutions surrounding smart-system integration, critical for the proliferation of the Internet of Things and advanced computing, will be thoroughly examined. Moreover, the session will provide insights into the latest advancements and best practices in chip design and testing methodologies, ensuring that the industry remains at the forefront of technological progress and can effectively meet the demands of future electronic systems. |
Technical meeting on April 23rd
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14 May 2020
by Super User
The MicroField team convened for a productive technical meeting on 23rd April 2020. In light of prevailing circumstances, the session was conducted entirely online, allowing participants to engage effectively despite the geographical distances. Discussions focused on the critical final stages required to bring the project to a successful conclusion by September 2020. A significant portion of the meeting was dedicated to in-depth technical exchanges across various work streams, culminating in the clear definition of outstanding tasks. The team is now committed to these concluding months, working diligently to finalise its deliverables and prepare for the concluding project review later in the year.
